A. Kteyan: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Rhodiola rosea in stress induced fatigue — A double blind cross-over study of a standardized extract SHR-5 with a repeated low-dose regimen on the mental performance of healthy physicians during night duty

V. Darbinyan, A. Kteyan, A. Panossian, E. Gabrielian, G. Wikman, H. Wagner

Journal:

Year:

2000

Language:

english

File:

PDF, 1.10 MB

english, 2000

2

Stress assessment for device performance in three-dimensional IC: linked package-scale/die-scale/feature-scale simulation flow

Kteyan, Armen, Gevorgyan, Gevorg, Hovsepyan, Henrik, Choy, Jun-Ho, Sukharev, Valeriy

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2014

Language:

english

File:

PDF, 9.73 MB

english, 2014

3

Postvoiding Stress Evolution in Confined Metal Lines

Sukharev, Valeriy, Kteyan, Armen, Huang, Xin

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2016

Language:

english

File:

PDF, 1.35 MB

english, 2016

4

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip Package Interaction

Sukharev, Valeriy, Choy, Jun-Ho, Kteyan, Armen, Hovsepyan, Henrik, Nakamoto, Mark, Zhao, Wei, Radojcic, Riko, Muehle, Uwe, Zschech, Ehrenfried

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 2.73 MB

english, 2017

5

Physics-Based Models for EM and SM Simulation in Three-Dimensional IC Structures

Sukharev, V., Kteyan, A., Zschech, E.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2012

Language:

english

File:

PDF, 1.53 MB

english, 2012

6

Microstructure Effect on EM-Induced Degradations in Dual Inlaid Copper Interconnects

Sukharev, V., Kteyan, A., Zschech, E., Nix, W.D.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2009

Language:

english

File:

PDF, 687 KB

english, 2009

7

AIP Conference Proceedings [AIP Publishing LLC PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES - Kuala Lumpur, Malaysia (17–19 December 2013)] - Physics-based simulation of EM and SM in TSV-based 3D IC structures

Kteyan, Armen, Sukharev, Valeriy, Zschech, Ehrenfried

Year:

2014

Language:

english

File:

PDF, 752 KB

english, 2014

8

Analysis of the Effect of TSV-induced Stress on Devices Performance by Direct Strain and Electrical Measurements and FEA Simulations

Kteyan, Armen, Muehle, Uwe, Gall, Martin, Sukharev, Valeriy, Radojcic, Riko, Zschech, Ehrenfried

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2017

Language:

english

File:

PDF, 2.31 MB

english, 2017

9

[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

Sukharev, Valeriy, Choy, Jun-Ho, Kteyan, Armen, Hovsepyan, Henrik, Muehle, Uwe, Zschech, Ehrenfried, Radojcic, Riko

Year:

2016

Language:

english

File:

PDF, 3.36 MB

english, 2016

10

[IEEE 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Kamakura, Japan (2017.9.7-2017.9.9)] 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Finite-difference methodology for full-chip electromigration analysis applied to 3D IC test structure: Simulation vs. experiment

Choy, Jun-Ho, Sukharev, Valeriy, Chatterjee, Sandeep, Najm, Farid N., Kteyan, Armen, Moreau, Stephane

Year:

2017

Language:

english

File:

PDF, 520 KB

english, 2017

11

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems

Sukharev, Valeriy, Kteyan, Armen, Choy, Jun-Ho

Year:

2019

File:

PDF, 1.41 MB

2019

12

Non-linear oscillations of the vortices in a hollow superconducting YBaCuO cylinder

M.T. Ayvazyan, A.A. Kteyan, R.A. Vardanian

Journal:

Physica C: Superconductivity

Year:

2004

Language:

english

File:

PDF, 425 KB

english, 2004

13

Thermal reduction effect on Curie temperature of LiNbO3 ferroelectrics

Karen G. Karapetyan, Armen A. Kteyan, Robert A. Vardanyan

Journal:

Solid State Communications

Year:

2006

Language:

english

File:

PDF, 242 KB

english, 2006

14

Bound electronic states on a dislocation kink in semiconductors

Robert A. Vardanyan, Armen A. Kteyan

Journal:

physica status solidi (c)

Year:

2007

Language:

english

File:

PDF, 378 KB

english, 2007

15

Electronic damping of dislocations and kinetic phenomena in superconductors under plastic deformation

A. A. Kteyan, R. A. Vardanian

Journal:

Journal of Low Temperature Physics

Year:

1997

Language:

english

File:

PDF, 1.09 MB

english, 1997

16

Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance

Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner

Journal:

Journal of Electronic Testing

Year:

2012

Language:

english

File:

PDF, 514 KB

english, 2012

17

Electronic Damping of Dislocations and Kinetic Phenomena in Superconductors Under Plastic Deformation

A. A. Kteyan, R. A. Vardanian

Journal:

Journal of Low Temperature Physics

Year:

1997

Language:

english

File:

PDF, 1.09 MB

english, 1997

18

Multi-phonon capture of charge carriers by dislocation kinks in semiconductors

Armen S. Vardanyan, Robert A. Vardanyan, Armen A. Kteyan

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 295 KB

english, 2008

19

Electronic polarizability of superconductors and inertial mass of a moving vortex

A. A. Kteyan, R. A. Vardanyan

Journal:

The European Physical Journal B / Condensed Matter and Complex Systems

Year:

2005

Language:

english

File:

PDF, 127 KB

english, 2005

20

Optimization of magnetron deposition process for formation of high-quality oriented ZnO films

E. R. Arakelova, A. M. Khachatryan, K. E. Avjyan, A. A. Kteyan

Journal:

Journal of Contemporary Physics (Armenian Academy of Sciences)

Year:

2012

Language:

english

File:

PDF, 221 KB

english, 2012

21

STOCHASTIC DYNAMICS OF DC AND AC DRIVEN DISLOCATION KINKS

VARDANYAN, A., KTEYAN, A.

Journal:

International Journal of Modern Physics B

Year:

2013

Language:

english

File:

PDF, 1.69 MB

english, 2013

22

Epilepsy care in Armenia. Data of 3382 consecutive epileptic patients

Yeghiazaryan, N.S., Khechumyan, Z., Kteyan, A., Amroyan, H.R., Ghambaryan, M., Mnatsakanyan, V., Balasanyan, M., Nahapetyan, N., Melikyan, G.R., Stepanyan, T.H.

Journal:

Journal of the Neurological Sciences

Year:

2013

Language:

english

File:

PDF, 81 KB

english, 2013

23

[IEEE 2009 10th International Symposium on Quality of Electronic Design (ISQED) - San Jose, CA, USA (2009.03.16-2009.03.18)] 2009 10th International Symposium on Quality of Electronic Design - Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation

Sukharev, Valeriy, Markosian, Ara, Kteyan, Armen, Manukyan, Levon, Khachatryan, Nikolay, Choy, Jun-Ho, Lazaryan, Hasmik, Hovsepyan, Henrik, Onoue, Seiji, Kikuchi, Takuo, Kamigaki, Tetsuya

Year:

2009

Language:

english

File:

PDF, 562 KB

english, 2009

24

On the Viscuous Damping Mechanisms for Vortices in Superconductors

Kteyan, A. A., Vardanian, R. A.

Journal:

Modern Physics Letters B

Year:

1998

Language:

english

File:

PDF, 212 KB

english, 1998

25

DYNAMIC DEFORMATION OF VORTEX LATTICE IN THE HOLLOW SUPERCONDUCTING YBaCuO CYLINDER

BABAYAN, V. H., AYVAZYAN, M. T., KTEYAN, A. A., VARDANYAN, R. A.

Journal:

International Journal of Modern Physics B

Year:

2009

Language:

english

File:

PDF, 732 KB

english, 2009

26

[AIP Stress-induced Phenomena in Metallization - ()] AIP Conference Proceedings - Microstructure Effect on EM-induced Degradations in Dual-Inlaid Copper Interconnects

Kteyan, A., Sukharev, V., Meyer, M.-A., Zschech, E., Nix, W. D., Ogawa, Shinichi, Ho, Paul S., Zschech, Ehrenfried

Year:

2007

Language:

english

File:

PDF, 1.52 MB

english, 2007

27

Design specific variation in via/contact pattern transfer: Full chip analysis

J. Choy, V. Sukharev, A. Markosian, A. Kteyan, Y. Granik, V. Bliznetsov

Year:

2009

Language:

english

File:

PDF, 1.07 MB

english, 2009

28

AIP Conference Proceedings [AIP FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011 - Grenoble (France) (23–26 May 2011)] - Stress-induced Effects Caused by 3D IC TSV Packaging in Advanced Semiconductor Device Performance

Sukharev, V., Kteyan, A., Choy, J.-H., Hovsepyan, H., Markosian, A., Zschech, E., Huebner, R., Seiler, David G., Diebold, Alain C., McDonald, Robert, Chabli, Amal, Secula, Erik M.

Year:

2011

Language:

english

File:

PDF, 885 KB

english, 2011

29

Auger recombination involving dislocations in semiconductors

A. A. Kteyan, A. S. Musayelyan, R. A. Vardanyan

Year:

2003

Language:

english

File:

PDF, 130 KB

english, 2003

30

[IEEE 2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) - Rome, Italy (2015.7.22-2015.7.24)] 2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) - Post placement leakage reduction with stress-enhanced filler cells

Choy, Jun-Ho, Sukharev, Valeriy, Kteyan, Armen, Hovsepyan, Henrik, Venkatraman, Ramnath, Castagnetti, Ruggero

Year:

2015

Language:

english

File:

PDF, 878 KB

english, 2015

31

Physics-based Electromigration Models and Full-chip Assessment for Power Grid Networks

Huang, Xin, Kteyan, Armen, Tan, Xiangdong, Sukharev, Valeriy

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2016

Language:

english

File:

PDF, 2.36 MB

english, 2016

32

ZnO film deposition by DC magnetron sputtering: Effect of target configuration on the film properties

Arakelova, E., Khachatryan, A., Kteyan, A., Avjyan, K., Grigoryan, S.

Journal:

Thin Solid Films

Year:

2016

Language:

english

File:

PDF, 788 KB

english, 2016

33

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 22 February 2009)] Design for Manufacturability through Design-Process Integration III - Design specific variation in pattern transfer by via/contact etch process: full-chip analysis

Sukharev, Valeriy, Singh, Vivek K., Rieger, Michael L., Markosian, Ara, Kteyan, Armen, Manukyan, Levon, Khachatryan, Nikolay, Choy, Jun-Ho, Lazaryan, Hasmik, Hovsepyan, Henrik, Onoue, Seiji, Kikuchi,

Year:

2009

Language:

english

File:

PDF, 392 KB

english, 2009

34

AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - 3D IC TSV-Based Technology: Stress Assessment For Chip Performance

Sukharev, Valeriy, Kteyan, Armen, Khachatryan, Nikolay, Hovsepyan, Henrik, Torres, Juan Andres, Choy, Jun-Ho, Markosian, Ara, Zschech, Ehrenfried, Ogawa, Shinichi, Ho, Paul S.

Year:

2010

Language:

english

File:

PDF, 4.17 MB

english, 2010

35

[IEEE 2017 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2017.4.2-2017.4.6)] 2017 IEEE International Reliability Physics Symposium (IRPS) - Theoretical predictions of EM-induced degradation in test-structures and on-chip power grids with analytical and numerical analysis

Sukharev, Valeriy, Kteyan, Armen, Choy, Jun-Ho, Chatterjee, Sandeep, Najm, Farid N.

Year:

2017

Language:

english

File:

PDF, 990 KB

english, 2017

36

[AIP LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24 - Orlando, Florida (USA) (10-17 August 2005)] AIP Conference Proceedings - Frequency Dependence of Vortex Lattice Elastic Moduli in the Hollow of Superconducting YBaCuO Cylinder

Vardanyan, Robert A., Ayvazyan, Mkrtich T., Kteyan, Armen A.

Year:

2006

Language:

english

File:

PDF, 827 KB

english, 2006

37

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages

Kteyan, A., Hovsepyan, H., Choy, J.-H., Sukharev, V.

Year:

2019

Language:

english

File:

PDF, 1.27 MB

english, 2019

38

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages

Kteyan, A., Hovsepyan, H., Choy, J.-H., Sukharev, V.

Year:

2019

File:

PDF, 1.27 MB

2019

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски